Laboratory for materials testing and joining technology/surface engineering
The laboratories introduced here for materials testing and joining technology and surface engineering are facilities of the Kiel University of Applied Sciences and are equipped with the most up-to-date technology to support teaching, research and technology transfer.
These resources are also available to business and industry as services. We offer investigations and consultations in the fields of materials and surface engineering and joining technology.
These services are at our clients’ disposal.
Metallographic joint investigations and damage analysis
- Analytical scanning electron microscope Philips XL30 for the analysis of heterogeneous joints (e.g., carbides/nitrides in steels, inclusions, etc.)
- Image analysis for quantitative determination of joint components
- SUTW-EDAX detector and associated software for the determination of chemical composition
- Modern light microscopes (OLYMPUS PROVIS , LEICA DMRM) with image processing (IMATEC) for quantitative determination of joints
- Microhardness test device Shimadzu HVM 2000 with data recording facility
- Servo-hydraulic test system MTS 250 (250 kN load cell) with hydraulic clamping device, high temperature test device and application programs for fracture toughness, fatigue strength, etc.
- Small-load test machine MTS Synergie with 1 kN, 100 N and 10 N load cells and pneumatic clamping device for testing wires and very small components
- Hardness test devices Vickers, Brinell und Rockwell
- Creep machine featuring a fine strain extensometer for creep testing at temperatures of up to 1,000°C
Roughness measuring station
- Protective gas furnaces for heat treatment of metallic materials. Determination of temperability
- High temperature protective gas furnace (Nabertherm, max. temperature 1800°C) for sintering ceramics
Joining technology / welding technology
- Measurement of cooling-off time t8/5 and determination of temperability of the heat-affected zone of welded joints
- Determination of the capacity of solders for wetting through a wetting balance or static wetting (hot stage microscope)